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The Unified Board (Version 5)

J.M. Brunet, S. Colonges, B. Courty, L. Guglielmi, 
J.J. Jaeger, G. Tristram and J. Waisbard 
Collège de France - Paris
I. Pepe - UFBA - Brazil

December 2001, 21 th

1 Introduction

In the Engineering Array (EA), the Local Station prototype modularity was the main concern behind the conception. Five different boards were plugged on two towers on top of a mother board.

In production phase, this mother board is replaced by a denser single board containing :

THE CPU CORE :

2 Mechanical Constraints

To minimize cabling and feed-through hardware, the SDE group and the tank designers have decided no longer to use the EA electronic enclosure concept. The Local Station (in a metal box) will be located on top of hatch-cover 1, inside of a plastic weather proof box with (400 x 400 mm) maximal dimensions. As in the preview design, the metal box plays a EM shielding role, so far its dimensions are not yet determined.
The Unified Board dimensions are setting to 240*340 mm (4 to 6 layers). For humidity protection, electronic box will be tropicalised.
The CDF team, had suggested during September 2001 workshop, to install a roof under the plastic box on the hatch cover, to permit air flow between the two pieces, then, to protect the electronic inside the box against the sun effects. This proposal is not yet accepted by P.O.MASUR in charge of plastic box design.

3 Electronic Hardware

In a precedent meeting, the SDE group has decided that the unified board will be, for good, spread in two parts. Initially, for the R&D needs, the connection between the CPU and the FE will be made using a DIN 41612 (for signals) and HE10 (for power supply) connector, being finally replaced by soldering pins in the production phase. In that sense, we have, what we can call, a Local Station final design (see next section). For pre-production, females connector are mounted on the unified board.

4 The Proposal

The concept presented in figure 1 shows the whole electronic hardware as part of one single PCB, except for the FE module. There is no motherboard, the CPU, the Time Tagging and the Slow Control are redesigned, forming a whole new card, where the GPS card will be connected and mechanically attached. In the production phase, the GPS card connection will be also made by soldering pins. On top of the new PCB, one can see four different sets of connectors. The first set concerns the FE, the old version PC104 (carrying the CPU Courty bus), makes place to a new DIN 41612 (96 pins), carrying the digital signal and digital power supplies to the FE. A smaller connector (HE10 type) will be used to transport the analog power supplies and the analog ground to the analog part of the FE.

Finally a fourth single (34 pins) HE10 connector will provide the CPU bus signals for the Ethernet card (ETH). A bus buffering interface will assure the reliability, the EM safety handling and the plug-in compatibility, between the ETH card and the CPU. This may be done only for pre-production. Then Ethernet will be deported with this new design, as consequence stability with Ethernet will be lower. We must keep in mind, that Ethernet was provided principaly for laboratory software development, and test. For a simplest way of communication and programmation for new UB, and for operations in the field, we will use in the new UB a serial port with a PPP protocol communication. Note that Ethernet connector will be not provided on the front panel connector, but only on the UB.
 


Figure 1 :Unified board electronic hardware

5 Power supply

For the Engineering Array, we are using a full homemade power supply, mounted on the motherboard's back-plane. Initially for the Unified Board we was planing to have a customized single package industrial-crafted solution. Actually, we are testing 3 different solutions :

*After several cost estimations, turns out that we will need to make a compromise between the homemade and the industrial solutions. In that sense, for the whole digital circuitry we are planing to use the same homemade concept, nevertheless we must minimize component dimensions (capacitors, shelf etc). For the analog section, as its power supply quality requirements are lot more restrictive, we are planing to use a of the shelf industrial-crafted switched power supply.

*Using shelf industrial-crafted switched power supply, for all the supply. This solution is better for reliability, but cost is a little higher.

*Using shelf industrial-crafted switched power supply for 12, +3V3 digital and +5Volts sections and switched regulator low power (Linear) for +/-3V3 analog section.
 

Power system protection :
 

In the Unified Board, we plan to have a electronic basic circuit, to shutdown the power supply on the UB during a specified time (closed to 3 hours) after had sent an alert to the CPU (during one minute), if an under or voltage occur, or if temperature on the UB is too high.
 

For a complete information on power supply, see reference [1].
 

6 FRONT END INTERFACE PIN-OUT AND DEFINITION

Local bus signals connector C1 - 2.54mm - 3x32 - type DIN 41612 - male on UB, female on FE

Signal name View from UB Function Pin number
LA 29 O Local Address C3
LA 28 O Local Address A4
LA 27 O Local Address C4
LA 26 O Local Address A5
LA 25 O Local Address C5
LA 24 O Local Address A6
LA 23 O Local Address C6
LA 22 O Local Address A7
LA 21 O Local Address C7
LD 31 I/O Local Data A12
LD 30 I/O Local Data C12
LD 29 I/O Local Data A13
LD 28 I/O Local Data C13
LD 27 I/O Local Data A14
LD 26 I/O Local Data C14
LD 25 I/O Local Data A15
LD 24 I/O Local Data C15
LD 23 I/O Local Data A16
LD 22 I/O Local Data C16
LD 21 I/O Local Data A17
LD 20 I/O Local Data C17
LD 19 I/O Local Data A18
LD 18 I/O Local Data C18
LD 17 I/O Local Data A19
LD 16 I/O Local Data C19
LD 15 I/O Local Data A20
LD 14 I/O Local Data C20
LD 13 I/O Local Data A21
LD 12 I/O Local Data C21
LD 11 I/O Local Data A22
LD 10 I/O Local Data C22
LD 9 I/O Local Data A23
LD 8 I/O Local Data C23
LD 7 I/O Local Data A24
LD 6 I/O Local Data C24
LD 5 I/O Local Data A25
LD 4 I/O Local Data C25
Signal name I/O function Pin number
LD 3 I/O Local Data A26
LD 2 I/O Local Data C26
LD 1 I/O Local Data A27
LD 0 I/O Local Data C27
EXT_TRIG O External trigger A1
-CAS 3 O Col. Addr Strobe (DRAM) A11
DRAMWE O Write Enable (DRAM) A2
-CS 4 O Chip Select FE trig A10
-CS 6 O Chip Select prog feature C10
-DMAA 0 O DMA ACK FAST A9
-DMAA 1 O DMA ACK SLOW C8
-DMAA 2 O DMA ACK SPARE A8
DMADXFER O DMA - synchro C1
EVTSYNCS 0 I Event Synchr. Slow C29
EVTSYNCF 0 I Event Synchr. Fast A29
EVTSYNCF 1 I Event Synchr. Fast A30
EVTSYNCF 2 I Event Synchr. Fast C30
-EVTCLKS I Slow trigger EvtClk C28
-EVTCLKF I Fast trigger EvtClk A28
-OE O Output Enable A3
-R/W O Read/Write C2
TC 0 O End of transfer A31
TC 1 O End of transfer A32
SYSCLK O CPU CLOCK C32
-RESET_FE O Reset C9
BUSERR I Bus error C11
GND Digital ground C31
GND B<1..27>
GND B31, B32
VCC Digital +3.3 V B<28..30>
Analog power supply connector C2 - 2.54mm - 2x5 - e.g. HE10 - male on UB, female on FE :
Supply name Pin number Description
AP3V3 1, 3 Analog supply +3.3v
AM3V3 7, 9 Analog supply -3.3v
AGND 2, 4, 5, 6, 8, 10  Analog ground
For the development and tests connectors could be used, with standard DIN41612 spacers should be 17 mm long. For the production the modules will be soldered then spacers will have to be smaller, e.g. 8 mm long or less.

Table 1. FE connection list.
 


 Figure 2 : specifications for Front End board dimensions 
 
7 Connectors 

7.1 The front panel connectors are as follows:

    1) Radio serial - DB9 female, Leeds pin-out

2) Console Serial - DB9 male

3) TPCB serial - DB9 male

4) ``Spare'' serial - DB9 male

5) PMT Power (x3) - DB15HD female

6) PMT anode and dynode inputs (SMA female, on front end, 6 total)

7) LED driver outputs (SMA female, 2 total)

8) Sensor cable - DB15HD female (with water level, air temperature inside or outside, external trigger input)

9) Power connector - two pins per B. Courty

10) Grounding plug on box exterior controller software
 
 
 

7.2 UB to PMT Connections

For the EA the SDE group decided to use a DB15 HD female for each PMT. This connector will transport the following signal:

The cable chosen is a 7 twisted pairs (this is to confirm with Joel POUTHAS), 24 AWG, no shielding, and we are planing to install a 20 mm long ferrite ring at one end, to minimize the common mode noise. For PMT output signals we are keeping the same EA (SMA) connectors. The slow control and the 3 signal cables will be tied together in order to avoid ground loops. All 3 PMT cables will have exactly the same length, those used for the PMT in hatch 1 will be tied together, as tight as possible, to minimize the cable slack, avoiding cable and ground loops.

Concerning the weather protection treatment, the PMT will be definitively attached to its base by soldering and finally the whole set will be potted. Once the PMT, the base and the cables are tested, the set will be potted together for good.
 
 

8 LED FLASHER :

9 Time Tagging :
 

We are studying two solutions in parallel, the ASIC solution, that seem working well, and a backup solution consisting of the use of PLD ACEX. For pre-production, we plan to have the two footprint (one for each solution) on the unified board. The final choice, then, should be made for the production after a full test of each solution.
 

10 GPS receiver :

11 Sensors and monitoring:

For the Unified Board, the list is reduced to essential sensors to achieve 16 channels of ADC, to simplify the unified board slow control section. The TPCB does all solar power monitoring.

During the review of the PMT bases, the need for a water temperature to assist in the corrections for changes in the photo-cathode temperature was discussed, and it was agreed that one of the two spares would be used for this. This temperature may also be useful to monitor tank freezing. The other spare will be reserved for a water level sensor. There was some discussion of the need for a water level sensor at all, and if there is a need what the real requirements were for it to be useful. Since this cannot impede unified board development, it has been decided to place the last ADC input on the same connector as the other spare (now reserved for the water temperature sensor). 12V will also be on this connector because it is required for the water temperature measurement. Any water level sensor must make use of the resources made available on this connector.
 
 
 

12 Slow Control


13 Test equipment and procedures:

L.A.L. laboratory (Orsay - France) is designing a test bench for all parts of the unified board. The Front End board, and the LED flasher will be tested separately. The status of the TPCB is still pending.
This will be done by connecting a PC with Linux system and ADC/DAC interfaces and using a specific electronic board to test interface between UB and FE. We must test all bits and signal (DMA, chip select...) on this interface with a simple electronic design. The software test will be running in both controller and PC with exchange information via Ethernet and/or the terminal serial port.
The test bench, is in a first step designed to test in a same time only one UB. A multiple test in the same time, will be study after this first step (maximum 5 UB tested in the same time).
We plan to have a complete test in temperature only for prototypes and samples of pre-production and production, to study the performance of the UB ( Tests with the test bench connected to the UB, with temperature cycling between -20 and +70 Deg / C, during 48 hours at least).

For the rest of the production, we plan to do a burning, with UB powered on, and a simply test mode (without a complete test bench in the oven).
We plan to have test bench in the factory, in the PCC laboratory, LAL laboratory and in Malargue in a first time.
Temperature range should be set between -20 Deg/C and 70 Deg/C
For Burn in, we plan to do 3 cycles with temperature cycling between -20 and +70 Deg/C during 6 hours, fallow with 16 hours at 70 Deg/C (This is the purpose of the Front End team). Then, the total time for this burn-in is 22 hours.
The first test bench should be ready for April or May 2001.

The principal components to test are :


14 EMC considerations

The unified board will be located on top of the large hatch cover (hatch 1) mounted in an inner metal enclosure. The whole set will be placed into a plastic weather proof box. The two main issues, concerning this enclosure design, are:

  1. Permits the signal and control cabling to reach the inside of the tank, but keeping light and environmental sealed.
  2. Avoid any RF and/or LF noise interference on the UB.
For power supply, just one (common) ground, being the zero volt reference for all the electronics parts. This common ground will be connected to the RF aluminum box and, if possible, connected to the battery negative pole either. For an electrical shock hazard prevention, we would have the solar panel brackets and the antenna mast at this very zero volt potential reference. We must keep in mind, that the first objective in EMC, is to minimize all the ground loop. Then, we must very carefully, with the link point of all ground. In the actual design, all grounds are linked in 3 points (UB power supply, front panel connector and PMT bases). See reference [1].
 

To minimize the virtual capacitance between the box bottom plane and the UB the UB ground plane must be tied to box at least every 100 mm. The same scheme must be adopted for the FE - UB fixation with brace brace, so, the longer side would have 3 contacts points and the shorter side 2 contacts.

Note: We must pay attention to the mechanical assembling quality of the contact points between ground plans, otherwise the LS could suffer of a capacitive coupling with the environment!!!!!

To avoid any RF frequency on the UB, with passing cables, all connectors will have their metallic part grounded and electrically connected to the front panel.
 

To protect electronic against electrostatic discharges (ESD), we will use some protections components against ESD (the SurgX family by COOPER). We want to protect in&outputs connected to external signals source.
 

Some safety considerations :

A floating electric powered equipment is a safety issue. The tank accumulates electrical charges, and the electrostatic potential increases, becoming an electrical chock hazard for humans and electronic circuits. Moreover, the tank is not lightning protected. As a full electrical protection of the tank, i. e., a high quality ground electrode (capable to be the Earth or Safety ground), a lightning rod and its appropriate cabling, a lightning protection for the radio unit, a metal grid or a conductive paint all over the tank, would be an expansive and complex issue for installation and maintenance, we are not considering this possibility, unless as an ultimate solution. What we are doing by now, is bet that a floating tank can remains out in the pampa for good, working fine. In that sense we would to point out some preventive measures, once working in tanks electronics:

  1. Use an anti-electrostatic carpet, connected to the zero volt reference (solar panel brackets).
  2. Use an anti-electrostatic bracelet, connected to the zero volt reference (solar panel brackets).
  3. Be careful during the cabling, avoiding large cable loops in order to prevent large inductive areas and a pick-up coupling. providing an indirect-impact lightning protection.
15 Quality
 

Quality insurance :

16 References

    [1] The Power Supply Procurement for the Unified Board of the Surface Detector The Pierre Auger Project

[2] http://cdfinfo.in2p3.fr/experiences/Auger/work.html: ``Local Station Controller User Manual''.

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File translated from TEX by TTH, version 2.51.
On 21 Dec 2001, 16:49.